Silicone Coated Fabric
Product Name : SILICONE COATED FABRIC
Product Code : ES-SCCF1500
ES-SCCF1500 is a double-sided silicone tape coated with a reusable silicone compound and heat resistive silicone adhesive. It is specifically designed to temporarily fix FPC or tiny components to carrier jig during SMT processing. Easy-to-clean silicone coated fabric is cost-effective due to its reuse even in high temperature environments.
Product Description
Physical Properties:
- Thickness : 1 mm
- Total weight (g/m2) :1500
- Weight of fiberglass fabric (g/m2) : 852
- Double side with silicone coated
- Tensile strength (N/5 cm ) Warp : ≥5500 Weft : ≥ 5000
- Width ( m ) : 1.5
- Operation temperature range ( ℃ ) ： – 50 ～ 250
Features & Benefits :
- Excellent dimensional stability at high temperature
- (No distortion, shrinkage/expansion at 260℃ continuous usage condition.)
- Superior adhesion and holding power of silicone adhesive
- No adhesive residue after removal
- Longer life time of silicone resin side
- Easy cleaning using cleaning roller allows extended lifetime
- Good surface flatness allows the whole area of FPC to be fixed
- Adhesion level of silicone compound can be controlled for customer’s requirement
- Excellent cut & die-cut properties
- Easy fixing and easy removal
- Provides flexibility for carrier design
Applications
1. SMT Process
– Reflow Soldering of FPC, Thin Rigid PCB & Rigid-flex PCB, etc2.Assembly Process (including curing, wire bonding, etc)
– MEMS Microphone – Camera Module, Vibration Motor – Wireless LAN Module, GPS Module – RF Module – Accelerometer Sensor, Gyro Sensor – Humidity Sensor, Temperature Sensor, etc. – Flip Chip Mounting Process – Flip Chip Mounting3.LED Packaging Process
– LED Chip Bonding, Wire Bonding, Molding, etc.4.Display Panel Process
– Carrier of LCD Panel, OLED Panel – Temporary Fixing of Touch Panel – Detaching Protection Films from LCD Panel or Polarizing Film – Probe Station – Fixing of Electrostatic Chuck5.Substrate Manufacturing Process
– Dicing of LTCC, CSP or Inductor substrates – MLCC Termination – Micro-polishing of Thin Package SubstrateRelated Products
